ASE Technology Holding Co., Ltd. (USD) Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

ASE Technology Holding Co., Ltd. (USD) Active

26, Chin 3rd Road, Kaohsiung, TW, 811

Stock Price USD

Price Change

Last Dividend USD

Latest Rating

ASX's stock peer is ALAB (Astera Labs, Inc. Common Stock)

ASX's stock peer is CTSH (Cognizant Technology Solutions Corporation)

ASX's stock peer is ERIC (Telefonaktiebolaget LM Ericsson (publ))

ASX's stock peer is HPE (Hewlett Packard Enterprise Company)

ASX's stock peer is MCHP (Microchip Technology Incorporated)

ASX's stock peer is MPWR (Monolithic Power Systems, Inc.)

ASX's stock peer is SMCI (Super Micro Computer, Inc.)

ASX's stock peer is TER (Teradyne, Inc.)

Technology Semiconductors

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

60%

Dcf Rating

80%

Return On Equity

80%

Return On Assets

20%

Debt To Equity

40%

Price To Earnings

40%

Price To Book

Income Statement

Dividend Stats Yield is calculated via trailing-12-month period

Ex-Dividend	Payment Date	Dividend	Yield	Dividend Frequency
2026-07-06	2026-08-07	0.42	1.04 %	Annual
2025-07-02	2025-08-06	0.36	3.46 %	Annual
2024-07-02	2024-08-05	0.32	2.87 %	Annual
2023-07-03	2023-08-03	0.56	7.22 %	Annual
2022-06-30	2022-08-04	0.47	8.80 %	Annual
2021-09-07	2021-10-07	0.30	3.30 %	Annual
2020-08-14	2020-09-17	0.14	2.98 %	Annual
2019-08-14	2019-09-12	0.16	3.76 %	Annual
2018-08-13	2018-09-12	0.16	10.82 %	Semi-Annual
		0.37	9.82 %	Semi-Annual
		0.29	3.67 %	Annual
		0.31	4.15 %	Annual
		0.40	6.24 %	Annual
		0.27	3.62 %	Annual
		0.22	4.41 %	Annual
		0.12	2.59 %	Annual
		0.13	1.95 %	Annual
		0.06	1.02 %	Annual
		0.09	1.62 %	Annual
		0.34	5.06 %	Annual
		0.24	2.81 %	Annual
		0.02	0.26 %	Annual

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2026-06-11 08:30:00

ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*

TAIPEI, June 9, 2026 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TWSE: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for May 2026.

2026-06-09 03:00:00

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from waf.

2026-05-26 09:00:00

ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*

TAIPEI, May 8, 2026 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TWSE: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for April 2025.

2026-05-08 06:15:00

ASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the First Quarter of 2026

TAIPEI, April 29, 2026 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX) ("We", "ASEH", or the "Company"), the leading provider of semiconductor assembly and testing services ("ATM") and the provider of electronic manufacturing services ("EMS"), today reported its unaudited[1] net revenues of NT$173,662 million for 1Q26, up by 17.2% year-over-year and down by 2.4% sequentially.

2026-04-29 02:45:00

ASE Holdings Hosts Annual Supplier Day to Recognize Outstanding Suppliers of 2025

TAICHUNG, Taiwan--(BUSINESS WIRE)--ASE Technology Holding Co., Ltd. (ASE Holdings. NYSE:ASX, TAIEX: 3711), today hosted its annual Supplier Day, recognizing the contribution of all its valued partners and to present awards to the outstanding suppliers of 2025. The event welcomed representatives from over 100 suppliers supporting ASE Holdings' subsidiaries – ASE, SPIL, and USI. Centered on the theme 'Innovation of Synergy,' the ceremony highlighted the role of technology innovation and knowledge.

2026-04-24 05:30:00

ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*

TAIPEI, April 10, 2026 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for March and 1st quarter of 2025.

2026-04-10 03:00:00

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