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26, Chin 3rd Road, Kaohsiung, TW, 811
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Stock Price USD
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Last Dividend USD
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Technology Semiconductors
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
100%
Dcf Rating
80%
Return On Equity
80%
Return On Assets
20%
Debt To Equity
60%
Price To Earnings
60%
Price To Book

Dividend Stats Yield is calculated via trailing-12-month period

Ex-Dividend Payment Date Dividend Yield Dividend Frequency
2024-07-02 2024-08-05 0.01 0.09 % Annual
2023-07-03 2023-08-03 0.02 0.24 % Annual
2022-06-30 2022-08-04 0.02 0.30 % Annual
2021-09-07 2021-10-07 0.01 0.12 % Annual
2020-08-14 2020-09-17 0.00 0.10 % Annual
2019-08-14 2019-09-12 0.11 2.50 % Annual
2018-08-13 2018-09-12 0.01 0.36 % Quarterly
0.01 0.20 % Special
2017-08-11 2017-09-15 0.01 0.12 % Annual
2016-08-17 2016-09-16 0.01 0.13 % Annual
2015-09-18 0.01 0.19 % Annual
2014-09-26 0.01 0.12 % Annual
2013-09-13 0.01 0.29 % Special
0.01 0.14 % Annual
0.00 0.09 % Annual
0.00 0.07 % Annual
0.00 0.03 % Annual
0.00 0.05 % Annual
2008-09-19 0.01 0.16 % Annual
0.01 0.09 % Annual
0.00 0.01 % Annual
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